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COMSOL 宣布将举办一场聚焦电磁制造技术前瞻应用的免费网络研讨会，主题为“下一代电磁制造技术的多物理场建模”。研讨会将展示如何通过 COMSOL Multiphysics 软件将电磁场与热学、化学、力学及传输现象进行耦合仿真，跨多个空间和时间尺度支持预测性建模，覆盖电磁传感、无损评估与先进材料加工三大方向。两个核心应用案例——金属板涡流测温与微波辅助陶瓷增材制造——将成为本次研讨的技术焦点。
涡流测温：三维温度场的非接触重建
第一个应用聚焦金属板的涡流测温技术。其原理在于温度变化会改变金属的电阻率，进而影响感应电流与磁场分布，由此实现体积化的热学推断。研究团队利用 COMSOL 仿真缺陷和激光诱导瞬态加热场景，为温度场重建算法提供验证数据支撑。此外，多频激励方案也在研究范围内——由于不同频率对应不同的穿透深度与灵敏度，通过频率维度的组合有望显著改善深度方向的分辨能力。
微波增材制造：能量直抵三维体积内部
第二个应用指向陶瓷构件的微波体积增材制造。高功率微波波束成形阵列可将能量局域化地输入三维体积内部，从而实现对不透明、高颗粒含量树脂的加工——这是传统光固化工艺难以触及的盲区。研究团队构建了涵盖电磁传播、微波吸收、传热与陶瓷烧结动力学的耦合模型，用于预测温度演化、反应进程、空间分辨率与工艺可扩展性。后续研究还将纳入脉冲激励、流体流动、树脂黏度、对流、收缩与固体力学等因素，进一步提升模型保真度。
【关键数据】
- 耦合物理场数量: 5 类（电磁、热、化学、力学、传输）
- 核心应用案例: 2 个（涡流测温、微波增材制造）
- 多尺度覆盖: 多个空间与时间尺度
- 后续扩展变量: 脉冲激励、流体流动、黏度、对流、收缩、固体力学等
仿真驱动研发：缩短从实验室到产业的路径
这两个案例的共同逻辑，是以仿真为核心纽带，连接传感、制造与数据反演三个环节。对于电磁制造这类强耦合、多参数的复杂系统，物理实验的迭代成本高昂且周期漫长，而多物理场建模能够在设计阶段完成参数筛选与工艺窗口预测，减少试错次数，并为规模化放大提供可靠性依据。随着计算资源与数据驱动方法的持续进步，仿真正在从“事后验证”转向“事前预测”，成为下一代电磁技术工程化的关键基础设施。
本次研讨会面向从事电磁传感、无损检测与先进制造的工程技术人员免费开放，感兴趣的读者可通过官方渠道注册参与。从涡流测温的工业检测潜力到微波增材制造的陶瓷加工突破，电磁多物理场建模的应用边界仍在持续扩展。
出处：Multiphysics Modeling for Next-Generation Electromagnetic Manufacturing Technologies
英文原文Advances in sensing, manufacturing, computational resources, and data-driven methods are enabling new approaches to electromagnetic sensing, non-destructive evaluation, and advanced materials processing. This webinar will demonstrate how the COMSOL Multiphysics software supports predictive modeling by coupling electromagnetic fields with thermal, chemical, mechanical, and transport phenomena across multiple length and time scales. The first application we will show focuses on eddy-current thermometry for reconstructing three-dimensional temperature fields in metal plates. Temperature-dependent electrical conductivity alters induced currents and magnetic fields, enabling volumetric thermal inference. COMSOL simulations of defects and laser-induced transient heating will support validation of reconstruction algorithms. Multifrequency excitation will be investigated to improve depth discrimination through frequency-dependent penetration depths and sensitivities. The second application examines microwave-enabled volumetric additive manufacturing of ceramic components. A high-power microwave beamforming array delivers localized energy into three-dimensional volumes, enabling processing of opaque, particle-laden resins. Coupled COMSOL models of electromagnetic propagation, microwave absorption, heat transfer, and ceramic sintering kinetics are used to predict temperature evolution, reaction progression, spatial resolution, and processing scalability. Future extensions will incorporate pulsed excitation, fluid flow, resin viscosity, convection, shrinkage, and solid mechanics. Together, these examples demonstrate how the COMSOL software can integrate multiphysics modeling with sensing, manufacturing, and data inversion. This webinar will present two applications of coupled electromagnetic and thermal modeling in COMSOL Multiphysics: eddy-current thermometry in metal plates and microwave-assisted processing of ceramic-loaded resins. By connecting simulation with practical engineering systems, COMSOL-based modeling can accelerate technology development, reduce experimental iteration, and support reliable scale-up of next-generation electromagnetic technologies. Register now for this free webinar!
