【资料成文时间】：2008-01-11
【语言】：Chinese
【页数】：63
【何人（公司）所著】：华为
【文件格式】：pdf
【文件原名】：华为RNC设计文档.pdf
【摘要或目录】：
1 前言 ............................................................................................................................... 3
2 总体结构 ................................ ................................ ................................ ........................ 3
2.1 网络结构 .......................................................................................................... 3
1.1 RNC 总体结构..................................................................................................5
1.1 RNC 对外接口..................................................................................................6
1.1. RNC 组网图...................................................................................................... 7
1.1 RNC 设计指标[2] ............................................................................................. 8
1.1 产品数据结构描述 ............................................................................................ 9
1 硬件实现方案 ...............................................................................................................10
1.1 硬件总体结构.................................................................................................10
1.1 物理单板结构 ................................................................................................. 11
1.1.1 MCP750 板................................ ................................ .............................. 11
1.1.1 HSC 板....................................................................................................12
1.1.2 MCPN750 板............................................................................................12
1.1.1 ETPA 板...................................................................................................13
1.1.2 ETKA板..................................................................................................13
1.1.1 BAK 板....................................................................................................14
1.1.1 RSK 板....................................................................................................14
1 软件实现方案 ...............................................................................................................18
1.1 总体结构 ........................................................................................................18
1.1 网络平台子系统（NPS） ................................................................................19
1.1 业务处理子系统（SPS）.................................................................................20
1.1 计费子系统（RRM） ................................ ................................ ......................22
1.1 资源控制子系统（RCS） ................................................................................23
1.1 操作维护（OM）............................................................................................25
1.1 单板软件结构 .................................................................................................26
1.1 功能流程........................................................................................................30
1.1.1 信令处理流程 ..........................................................................................32
1.1.2 数据转发流程..........................................................................................35
1.2 软件开发平台 .................................................................................................36
2 信号完整性工程设计.....................................................................................................36
2.1 关键总线分析.................................................................................................36
2.1.1 PCI 总线简介...........................................................................................36
2.1.2 CompactPCI 简介.....................................................................................36
2.2 物理实现关键技术分析 ...................................................................................38
3 可靠性设计 ...................................................................................................................38
3.1 MPU板倒换备份............................................................................................38
3.2 计费高可靠性.................................................................................................40
4 器件选型 ................................ ................................ ................................ ......................41
4.1 电源选型方案 .................................................................................................41
1.1 计算机\网络配套设备选型方案........................................................................41
1.1.1 LAN Switch 认证方案................................ ................................ ..............41
1.1.2 对 Router 的需求................................ ................................ ......................42
2 可维护性设计 ...............................................................................................................42
2.1 状态指示 ........................................................................................................42
2.2 测试 ...............................................................................................................42
2.3 软硬件版本信息在线上报和软件加载................................ ..............................43
2.4 网管及远程维护................................ ................................ ..............................43
2.5 故障定位及处理................................ ................................ ..............................43
2.6 人机界面设计 .................................................................................................44
2.7 数据设定与操作................................ ................................ ..............................44
2.8 可扩容性 ........................................................................................................44
3 可测性设计...................................................................................................................45
3.1 测试项目设计.................................................................................................45
3.2 可测性需求设计................................ ................................ ..............................45
3.3 装备可测性设计方案.......................................................................................45
4 结构、外观设计方案.....................................................................................................46
4.1 造型设计方案 .................................................................................................46
4.2 结构设计方案及系统配置................................................................................46
4.3 安装设计方案 .................................................................................................47
4.4 结构热设计方案................................ ................................ ..............................47
4.5 结构 EMC 设计方案........................................................................................47
5 工艺设计方案 ...............................................................................................................47
5.1 配线方案 ........................................................................................................47
5.2 关键工艺的解决方案.......................................................................................49
5.3 产品测试路线 .................................................................................................52
5.4 产品制造方案 .................................................................................................52
5.4.1 机柜/插框/部件总体方案..........................................................................52
5.4.2 防护性.....................................................................................................53
5.4.3 可运输性 .................................................................................................53
5.4.4 特殊工艺流程 ..........................................................................................54
5.4.5 制造瓶颈分析及解决................................................................................54
6 环境适应性设计的实现方案..........................................................................................54
6.1 洁净度要求.....................................................................................................54
1.1 抗干扰要求.....................................................................................................55
1.2 空间要求 ........................................................................................................55
1.3 接地要求 ........................................................................................................55
1.4 温度湿度要求 .................................................................................................55
1 电源及外购外包件需求定义..........................................................................................56
1 安全性 ..........................................................................................................................60
2 电磁兼容设计方案 ........................................................................................................60
3 产品规格其他内容的实现途径.......................................................................................61
4 候选方案 ................................ ................................ ................................ ......................61

[ 本帖最后由 uniquer 于 2009-5-3 09:42 编辑 ]